Reflow Ovens
Revolutionize Your PCB Assembly with Our Reflow Ovens
Our high-performance reflow ovens are designed to take your printed circuit board (PCB) assembly and semiconductor packaging to the next level. With advanced technology and precision engineering, our solder reflow ovens ensure optimal soldering results, increased efficiency, and impeccable product quality. Discover how our reflow ovens can transform your manufacturing processes.
• Superior Heat Distribution: Our ovens feature state-of-the-art heating elements and airflow systems, ensuring uniform heat distribution across the PCB surface. Say goodbye to inconsistent solder joints and hello to reliable and durable connections.
• Flexible Soldering Profiles: Tailor the soldering process to meet the unique requirements of your PCB assembly. Our ovens offer a range of customizable soldering profiles, allowing you to achieve the perfect balance of temperature, time, and ramp rates.
• Precise Temperature Control: Experience precise temperature control throughout the soldering process. Our ovens maintain tight temperature tolerances, minimizing thermal stress on components and maximizing solder joint integrity.
• Versatile Compatibility: Our solder ovens are suitable for a wide range of applications, from small-scale PCB assembly to large-scale semiconductor packaging. Enjoy the flexibility to handle diverse product sizes and complexities.
Unleash Efficiency and Productivity in Your Manufacturing
Our ovens are not just about superior soldering results—they are also designed to streamline your manufacturing processes, boost productivity, and increase your bottom line. Discover the exceptional benefits of integrating our SMT reflow ovens into your operations.
BTU International
A wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), BTU International stands as a global supplier and technology leader in advanced thermal processing equipment solutions for the electronics manufacturing market. Specializing not only in precision-controlled, high-temperature belt furnaces for custom applications like brazing, direct bond copper, diffusion furnace, aluminum sintering, and advanced solar cell processing, BTU has also become synonymous with Reflow Ovens—an integral component in their comprehensive thermal processing lineup.
Since its inception in 1950, BTU International has earned the status of a trusted name, having shipped over 10,000 units to customers worldwide who seek to address high-volume thermal processing challenges. Recognized for excelling in processes where precise control of atmosphere and temperature is paramount to product yield, BTU’s commitment to quality is reinforced by being an ISO certified company with manufacturing facilities in both the USA and China. Whether it’s advanced thermal processing solutions or the latest in Reflow Ovens, BTU International continues to lead the industry in providing cutting-edge technology and expertise to meet the evolving needs of electronics manufacturers.
BTU’s Pyramax™
Family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for SMT solder reflow, semiconductor packaging and LED packaging and assembly.
Pyramax™ reflow ovens provide optimized lead-free processing for the ultimate productivity and efficiency.
With 6, 8, 10, and 12-zone air or nitrogen models, 350oC maximum temperature, and a comprehensive menu of options, Pyramax™ reflow ovens are the industry’s most versatile performers and best value.